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| Shenzhen Zhiboxin Printed Circuit Board Co., Ltd. | ||||||
| About this company : We specialize in manufacturing Printed Circuit Board for 9 years. We are committed to excellent quality and customers’ satisfaction. With instant quotes, superior service and on-time deliveries, we make us a reliable supplier both in domestic market and abroad. Certificate: ISO9001:2000, ROHS, UL Our service is mainly covering : Single/ Double sided PCB Multilayer PCB High-density/precision board/ HDI Flexible and Rigid PC Blind and Buried board PCB Assembly PCB Design Quick turn Sample HAL, Gold Finger, Gold Plating, Flash Gold, Electro less Gold Plating, Flux Goating, Immersion gold, etc. | ||||||
| Contact : Hetty Huang, Export Sales | ||||||
| Headquarters : 507, East Block of Wanyuan Building, West Hongli Road, of Futian District, Shebzhen, Guangdong, 518000, China | ||||||
| Phone : +86-755-83266645, Fax : +86-755-83266545 | ||||||
| Website : Log on to trade instantly , Email : Log on to trade instantly | ||||||
 | Mobile Phone PCB SZZBX-CB43 Material: FR4 Layers: 8/L Surface Finishing: Immersion Gold Thickness: 1.0+/-0.10mm Min Line Width: 0.10mm Min Line Spacing: 0.10mm Min Hole Diameter: 0.10mm Special Technologr: Blind Via | |||||
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 | 8 Layers BGA Blind / Buried PCB RoHS & UL SZZBX-CB057 1) 8-layer PCB 2) Min. line space: 0.1mm 3) Min. line width: 0.1mm 4) Min. hole diameter: 0.25mm 5) Thickness: 1.6mm 6) Board technology: HASL + Goldfinger | |||||
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 | Double Sided FR4 PCB RoHS & UL SZZBX-CB103 Material: FR-4, CEM-1/2/3, 94v0, 94hb and so on Surface finish: HAL, gold plating, gold finger, immersion silver, immersion gold, immersion tin, OSP and so on Profile: routing, punching, V-CUT, chamfering Mini hole: 0.2mm Mini line width: 4mil (0.1mm) Mini line space: 4mil (0.1mm) Copper thickness: from 0.5oz. to 6oz. Special process: blind/buried hole Inner packing: Vacuum package Outer packing: Carton Lead time: 7-10 days | |||||
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 | FPC RoHS & UL SZZBX-CB093 1) Min. trace width : 0.1mm 2) Min. space between trace: 0.1mm 3) Min. hole size: 0.20mm 4) Thickness tolerance: a) Single sided: 0.12mm b) Double sided: 0.15mm 5) Base materials: polyimide and polyester 6) Conductor (copper thickness): 0.5oz., 10oz. and 20oz. (RA and ED copper) 7) Cover-layer: polyimide and polyester (solder mask printing is available) 8) Adhesive material: epoxy, acrylic and polyester 9) Stiffener materials: FR-4, mylar and polyimide 10) Surface finishes: flash gold plating, selective gold plating and solder plating | |||||
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 | Printed Circuit Board RoHS & UL SZZBX-CB31 Board layer: 1 Material: FR-4 Min. Board thickness: 0.2mm Min. Line width: 0.1mm Min. Line spacing: 0.1mm Min. Hole diameter: 1.25mm Surface finishing: OSP / Entek / HAL Board thickness: 1.5mm Main export markets: Eastern Europe, Western Europe, North America, Asia Packing: Vacuum packing Lead time: 3-4 days for samples and 7-12 days for big orders | |||||
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